|Exam Name||:||DB2 UDB V7.1 for UNIX, Linux, Windows and OS/2 Database Administration|
|Questions and Answers||:||137 Q & A|
|Updated On||:||January 19, 2018|
|PDF Download Mirror||:||000-513 Brain Dump|
|Get Full Version||:||Pass4sure 000-513 Full Version|
Given the following:
SYSADM group name (SYSADM GROUP) = ADMIN SYSCTRL group name
(SYSCTRL GROUP) = CONTROL SYSMAINT group name (SYSMAINT GROUP) = MAINT
Which two of the following determines which users have SYSCTRL authority? (Choose two.)
The node directory
The system catalog
The operating system security
The database configuration file
The database manager configuration file
In which of the following locations must userids and passwords be defined if using
The node directory on the server
The node directory on the client
The system catalog on the server
The operating system on the server
The operating system on the client
When scheduling a job, certain actions can be specified to take place upon completion or failure of the job. Which two of the following actions does this include? (Choose two.)
Run a command script.
Send a page to a pager.
Send a message to the job log.
Re-run the job that just completed.
Send an emaiI to an indicated address.
Which of the following must be performed to restrict clients from being able to discover ALL DB2 instances on a server?
Set the DISCOVER_COMM parameter to NONE.
Set the DISCOVER_DB parameter to DISABLE.
Set the DAS instance parameter SEARCH to DISABLE.
Set the DAS instance parameter DISCOVER to DISABLE.
Which of the following DB2 commands updates information used by the optimizer when choosing an access path?
Which of the following statements is TRUE?
DB2MOVE does not support LOBs.
DB2MOVE supports the datalinks data type
DB2MOVE supports DRDA data resources and targets.
DB2MOVE supports LOBs residing on disk in separate files
DB2MOVE supports exporting and importing trigger definitions
For which of the following event types can event monitors be used to gather information?
DATABASE, DEADLOCKS, BUFFERPOOLS, SORTS, TRANSACTIONS
DATABASE, TABLES, DEADLOCKS, BUFFERPOOLS, SORTS,
DATABASE, DEADLOCKS, BUFERPOOLS, SORTS, CONNECTIONS,
DATABASE, TABLES, DEADLOCKS, BUFFERPOOLS, CONNECTIONS,
Given the following data from syscat.tabauth:
Exhibit missing. Will be fixed in later versions
Which of the following users CANNOT view the data in table MYTAB?
Given the following data from SYSCAT.TABLES with partial dates:
Exhibit missing. Will be fixed in later versions
Which of the following tables will benefit most from being reorganized?
Given the following piece of a LIST APPLICATIONS output:
Exhibit missing. Will be fixed in later versions
Which of the following commands terminates the client application's connection?
KILL APPLICATION (7)
DISCONNECT APPLICATION (7)
KILL APPLICATION payroll.exe
FORCE APPLICATION payroll.exe
DISCONNECT APPLICATION payroll.exe
Given the following table:
Exhibit missing. Will be fixed in later versions
Which of the following statements and in what order must they be called to restrict normal users from seeing the salary of a particular person, but allowing the users to see the name?
Given the table definitions:
Exhibit missing. Will be fixed in later versions
Which of the following conditions must be met before the update will be
Owner_id 12345 muist exist in the id.pc table
Owner_id 12345 must not exist in the id.pc table
Employee_num 12345 must exist in the id.employees table
Employee_num 12345 must not exist in the id.employees table
Given the exhibit:
Exhibit missing. Will be fixed in later versions How many base tables are accessed in the query?
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what is described is an electrical module with a microphone integrated therein.background
A microphone module with an encapsulated MEMS microphone (MEMS=Micro Electromechanical gadget) is common from the booklet J. J. Neumann, Jr., and k. J. Gabriel, “a fully-integrated CMOS-MEMS audio microphone,” 12th international convention on strong State Sensors, Actuators and Microsystems, 2003 IEEE, pp. 230-233. Described therein is a module having a quantity for force equalization (lower back quantity).
An electrical module with a built-in MEMS piezoresistive microphone is familiar from the e-book D. P. Arnold et al., “A directional acoustic array the usage of silicon micromachined piezoresisitive microphones,” J. Acoust. Soc. Am., vol. 113(1), 2003, pp. 289-298.
in the publication Mang-Nian Niu and Eun Sok Kim, “Piezoelectric Bimorph Microphone built on Micromachined Parylene Diaphragm,” Journal of Microelectromechanical programs, vol. 12, 2003 IEEE, pp. 892-898, a piezoelectric microphone having two piezoelectric layers of ZnO and a floating electrode arranged therebetween is described.abstract
Described herein is an electrical module with a developed-in MEMS microphone that has a high sign-to-noise ratio.
An electrical module with a built-in microphone is described. The module contains a base plate with an acoustic channel fashioned therein. One embodiment comprises a primary cavity connected by means of a sound inlet opening to the exterior, with a MEMS microphone chip organized therein, and a 2d cavity, appropriate as an acoustic back extent and related to the acoustic channel. The microphone chip may well be connected to the bottom plate, organized above a gap shaped within the base plate, and related by way of this opening to the acoustic channel buried within the base plate.
the primary cavity can coincide with the outside. The diaphragm of the microphone chip separates the first cavity from the acoustic channel, which opens into a 2nd cavity. The second cavity could be alongside the first cavity. The acoustic channel may additionally run at least partially beneath both cavities.
A pressure stability between the 2nd cavity and the acoustic channel is possible by using air interchange. a fast air interchange between the primary and the 2nd cavity—i.e., an air interchange in a period on the order of the oscillation period of the microphone diaphragm within the working frequency latitude—may well be avoided via the diaphragm of the microphone chip. A sluggish air interchange (in a length that's longer than the biggest oscillation length of the microphone diaphragm in the operating frequency latitude) between both cavities is even so viable by way of a air flow opening whose pass-sectional size is evidently smaller than the go-sectional measurement of the diaphragm.
The acoustic channel can be at the least sufficiently large in cross section that the drive exchange within the proximity of the diaphragm of the microphone chip will also be hastily compensated. The go-sectional dimension of the acoustic channel or the channel openings can be at least 5% of the diaphragm surface enviornment.
Microphones that detect sound power by way of diaphragms are dependent on a huge diaphragm expedition in reaction to the sound depth in an effort to achieve the preferred traits involving sensitivity and noise habits. For small accessories with developed-in microphones, the available excursion is limited by means of the small diaphragm floor enviornment. because of this, best susceptible electrical signals can also be acquired when the diaphragm excursion is converted into an electrical variable. The compliance of a diaphragm manufactured in a separate technique may also be worsened by way of a high inner mechanical stress caused by way of a biasing of the diaphragm.
MEMS microphones described right here have an air chamber (first cavity) connected to a sound enter opening as well as a returned extent formed by using the acoustic channel and the second enviornment. lower back extent refers to enclosed air volumes, with which an acoustic short-circuit—an undesired power balance between entrance and lower back of the vibrating diaphragm—is prevented. For each diaphragm deflection, this air volume produces a restoring drive apart from the restoring force led to with the aid of the bendy diaphragm characteristics.
in the microphone particular here, the returned volume may be formed by using a horizontal acoustic channel shaped within the service substrate under the two facet-by way of-facet cavities, and by means of the quantity of the different cavity. With this specifically gigantic lower back volume, the relative power adjustments in the lower back volume, caused via the diaphragm vibrations, and the associated restoring force affecting the diaphragm will also be stored small.
In an embodiment, the module contains a cover that has a separation ridge connecting two contrary side faces of the cowl and sealing to the base plate. Between the bottom plate and the cover, for instance, the first cavity connected by the use of a sound inlet opening to the exterior and the second cavity isolated from it by means of the separation ridge of the cover are formed. The sound inlet opening could be arranged in the cover.
The acoustic channel and the 2d cavity collectively kind a returned volume. An skills of this embodiment is that the back extent is organized partly within the base plate and partly thereabove. thus a big component of the module volume is used as the acoustic back extent.
A microphone chip includes a carrier substrate, with a diaphragm able to vibrating. The microphone chip may also have a piezoelectric layer as smartly metallic layers and/or electrode constructions connected thereto, clamped therein above a recess or a gap.
There can be an adhesion-promotion and/or sealing mechanism, e.g., a glue layer or an epoxy resin layer, between the cowl and the plate.
The microphone chip is arranged above a primary opening offered within the base plate, which opens into the acoustic channel and the primary cavity. the bottom plate has a second opening, during which the acoustic channel is linked to the second cavity. The move-sectional dimension of the first opening can also correspond to roughly the go-sectional size of the microphone chip's diaphragm. The go-sectional dimension of the second opening can be selected in such a way that a fast air interchange between the acoustic channel and the 2d cavity is possible.
With the microphone, the restoring force appearing on the diaphragm will also be reduced and the diaphragm day trip accelerated.
In an embodiment, the bottom plate contains a primary layer with a recess linked to the acoustic channel shaped in it, and a second layer organized above the primary layer, which partly covers the recess for forming an acoustic channel as much as the above-outlined openings. The separation ridge of the cover can also seal to the second layer.
the primary layer of the bottom plate can optionally be a glass-fiber strengthened organic laminate, or include ceramics. the first layer of the bottom plate can comprise a few homogeneous or distinctive dielectric sublayers arranged one above an additional, between which structured metallic layers are organized. The sublayers can also be shaped from a tumbler-fiber bolstered biological laminate or ceramics. The 2nd layer of the base plate is formed with a primary layer, which might also consist of an extra fabric similar to ceramic, fashioned like a solder cease mask (of acrylate or epoxy resin in one embodiment).
The second cavity can condo at least one chip element, e.g., a resistor, a capacitor, an inductor, a filter, an impedance transformer and an amplifier. The chip aspect may well be correct for floor mounting.
The microphone chip can also be installed with a flip-chip development method and electrically linked via bumps to electrical contacts organized on the higher side of the bottom plate. In a different embodiment, the microphone chip may also be electrically connected by bonding wires to electrical contacts arranged on the higher facet of the base plate. The interfaces fashioned by means of the opposing mounting surfaces of the chip and the bottom plate may be sealed by way of adhesion, underfilling or soldering, as an example. A solder frame or a frame made of potting compound can be arranged between the chip and base plate. within the case of a solder body, it is expedient to form a solderable metallization, whose outline corresponds to the kind of the frame in the lateral airplane, on the upper aspect of the bottom plate and the decrease surface of the microphone chip.
in one embodiment, the cover includes a cap of plastic or ceramic lined with a conductive layer. The cowl can even be fashioned from metallic.
In case of a huge acoustic pressure, such big height-to-top oscillation amplitudes of the diaphragm can turn up that a nonlinearity in the electroacoustic transformation of the diaphragm oscillation into an electrical sign, and hence signal distortion, results. This difficulty is remedied in one embodiment, during which a poor-feedback compensation circuit is related to a diaphragm. Deflection of the diaphragm provoked with the aid of the compensation circuit opposes the deflection of the diaphragm caused with the aid of the acoustic pressure, and compensates it to a big extent, in order that the diaphragm oscillates with a reduced amplitude or doesn't oscillate in any respect. The electrical parameter produced through the compensation circuit, as an instance, a potential, is proportional to the acoustic force or the sign to be detected. Any favored electrical circuit correct for negative remarks is relevant as the compensation circuit.
in line with another embodiment of the microphone, the diaphragm is clamped to the carrier substrate best at one aspect, whereas its conclusion contrary the clamped end can oscillate freely above an opening formed within the provider substrate when an acoustic sign is applied. Clamping on each side is additionally feasible, by which case most effective two contrary diaphragm ends are arranged above the service substrate. A diaphragm carrier in a position to oscillation it truly is sealed to the carrier substrate on each side, e.g., a versatile movie, can be stretched over the hole in the service substrate. The diaphragm is discovered on the diaphragm carrier.
right here materials are proper as a piezoelectric layer in all embodiments: ZnO, lead zirconate titanate (PZT) and aluminum nitride.
it's proposed that a diaphragm with as a minimum one piezoelectric layer be to a huge extent symmetrical related to its layer succession and layer thickness. In specific, bending moments that advance because of distinctive coefficients of enlargement of sequential layers are compensated even for giant temperature discontinuities. Warping of the diaphragm can hence be avoided over a huge temperature range. This measure is above all applicable to a bimorph diaphragm structure.
A microphone might be described in aspect below on the foundation of embodiments and the connected figures. The figures display embodiments of diverse models of the microphone on the basis of schematic representations, no longer drawn to scale. similar or identically functioning components are labeled with the identical reference symbols.DESCRIPTION OF THE DRAWINGS
FIG. 1 schematically shows an illustration of an electrical module with a built-in microphone;
FIG. 2A, an electrical module with a microphone chip, an acoustic channel and two cavities in move section;
FIG. 2B, the view of the module of FIG. 2A from above;
FIGS. 3A, 3B, an additional electrical module;
FIG. four, a microphone with a diaphragm comprising a piezoelectric layer;
FIG. 5, a microphone with a diaphragm having a bimorph structure.specific DESCRIPTION
FIGS. 1, 2A, 2B, 3A, 3B each exhibit an electrical module with a developed-in microphone chip MCH. The microphone chip can also be shaped, as an instance, based on one of the crucial configurations offered in FIGS. four and 5.
Microphone chip MCH is arranged on a base plate BP above an opening fashioned therein—sound opening IN in FIG. 1 and/or opening W1 in FIG. 2A. Microphone chip MCH could be tightly sealed on each side to the upper facet of base plate BP, on which a canopy CAP is arranged.
A closed cavity, which is used as an acoustic lower back extent, is fashioned between microphone chip MCH, the upper aspect of the base plate and canopy CAP. additionally, a chip element BE1 electrically related to microphone chip MCH is arranged in this cavity. extra chip components BE2 are located on the base plate BP outside of the closed cavity. The electrical connections between the module accessories just outlined are buried partially in multilayered base plate BP.
FIGS. 2A, 2B display an additional embodiment of an electrical module, by which the sound inlet opening IN is shaped in the cowl CAP. FIG. 2A indicates the electrical module in a schematic move part, and FIG. 2B indicates a schematic view of this module from above through its cover.
Base plate BP comprises a lower layer S2 and an upper layer S1 arranged thereon. In layer S2, an acoustic channel AK is equipped in the sort of a blind gap or a trench extending in a longitudinal course. As viewed from above, layer S1 can also cowl this blind hole completely, up to a primary opening W1 and a 2d opening W2. Layer S1 can be fashioned, for instance, as a solder cease mask.
a cover CAP, which has a separation ridge TS that interconnects two opposing facets of the cowl, is organized on layer S1. cowl CAP could be sealed tightly on all sides to the higher side of base plate BP or to its higher layer S1. A glue layer KS may also be organized between them for adhesion promotion or sealing.
A microphone chip MCH, which is sealed tightly on each side to layer S1, is arranged above first opening W1 of layer S1. A sealing frame KS1 is arranged between microphone chip MCH and layer S1. Sealing frame KS1 may also be formed from potting compound in one embodiment. In an extra embodiment, sealing frame KS1 may also be formed as a solder body.
Two cavities HR1, HR2, that are connected via acoustic channel AK and isolated from one one other by using microphone chip MCH arranged in first cavity HR1, are shaped between the S1 and canopy CAP by way of separation ridge TS of the cover. First cavity HR1 is related by way of sound inlet opening IN to the outside.
Chip accessories BE1, BE2, which are electrically related by means of contacts K1-K3 arranged on the base plate to at least one an extra and to microphone chip MCH, are arranged in 2nd cavity HR2.
On the upper facet of microphone chip MCH, a contact surface AF is arranged, which is electrically related, e.g., to the first electrode of the microphone, and to an electrical contact K1 found on layer S1 by the use of a bonding wire. The contact K2 shown in FIG. 2B could be electrically linked to the 2nd electrode of the microphone.
The acoustic returned volume is shaped with the aid of an air quantity enclosed in acoustic channel AK and 2d cavity HR2. The simple element is that acoustic channel AK connects the remote cavity HR2 to the rear side of microphone chip MCH and as a result makes available an increased back quantity.
FIGS. 3A and 3B signify one more electrical module with a constructed-in MEMS microphone in go part and in plan view via cover CAP, respectively. Layer S1 here covers just one part of the recess provided in layer S2 for the formation of acoustic channel AK. Opening W1, which concerns into acoustic channel AK and is isolated by means of the decrease floor of microphone chip MCH and a sealing body KS1 from first cavity HR1, is provided in layer S1.
Opening W2 connecting acoustic channel AK to 2nd cavity HR2 is fashioned in that a part of layer S2, within the area of the recess formed therein, is not covered via layer S1.
In an embodiment, layer S1 is fully coated by the cover CAP, wherein separation ridge TS rests upon on this deposit and is fixedly linked thereto by way of glue layer KS. in this illustration, the top of separation ridge TS is lower than the peak of the external walls of the cowl.
Microphone chip MCH is fixedly linked to layer S1 via a frame-like glue layer KS1 (or solder layer) organized within the peripheral area of microphone chip MCH. for that reason, opening W1 of the acoustic channel is isolated from first cavity HR1. Layer KS1 serves to seal off the interface between microphone chip MCH and layer S1.
FIG. four shows an example of a MEMS microphone chip with a piezoelectric microphone. The microphone chip includes a provider substrate SU in which an opening is fashioned, above which a diaphragm M1 is arranged on a provider TD capable of oscillating. The diaphragm has a piezoelectric layer PS1 arranged between two metallic layers ML1, ML2. Contact surfaces AF, which can be electrically linked to the electrodes shaped in metal layers ML1 and/or ML2, are organized on the higher facet of provider substrate SU.
FIG. 5 shows in schematic go section a microphone chip with a carrier substrate SU and a diaphragm M1 with a bimorph structure stretched out thereabove. Diaphragm M1 has a primary piezoelectric layer PS1 organized between an outer steel layer ML3 and a valuable steel layer ML2, as well as a second piezoelectric layer PS2 organized between an outer metallic layer ML1 and a valuable metallic layer ML2. The piezoelectric axes within the two layers PS1, PS2 will also be organized within the same direction or in contrary instructions.
A bimorph diaphragm constitution has the competencies over a diaphragm with only one piezoelectric layer in that it's possible to achieve twice as huge an electrical sign for the same diaphragm curvature, given that the potentials of the two piezoelectric layers are additive.
The layer thicknesses of the layers forming diaphragm M1 can be chosen to be symmetrical relative to metallic layer ML2. The piezoelectric layers have the equal thickness and the equal orientation of their piezoelectric axes. the two outside metallic layers ML1, ML3 may be fashioned with equal thickness.
On the higher side of carrier substrate SU, electrical contacts AE1, AE2 are organized, which can be electrically connected on the one hand via electrical results in electrodes shaped in steel layers ML1 and ML2, and nonetheless, by means of plated-through holes DK to contact surfaces AF organized on the lessen surface of the provider substrate SU.
In an embodiment, a air flow opening, which is small relating to the cross-sectional dimension of the diaphragm and serves for a slow drive equalization in the range of ≧one hundred ms, may also be supplied to join the enclosed air volume (again volume of the microphone) to the outside. The force is equalized slowly in terms of the length of an acoustic signal with the biggest wavelength in the working range of the microphone. This opening may also be organized within the diaphragm or in a wall of the container enclosing the acoustic back extent.
The module isn't limited to the number or the special kind of the facets, microphones and/or microphone chips proven within the figures, or to the audible acoustic range from 20 Hz to twenty kHz. extra piezoelectric acoustic sensors, such as distance sensors operating with ultrasound, are also possible. A microphone chip may also be used in any desired signal processing module. distinctive embodiments may also be combined.
it is viable to form the service substrate as a multilayer constitution with structured printed conductors integrated therein to realize, for example, electrical leads, inductors, capacitors and resistors.
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[2 points] The pupil can use Yesr1 v 10 to most effective.r checklist one row for yesr1 v 10 linked Wllh salvage vaIue It couId have one row of yr 1-9 cash circulate and a different row of yrm money circulation which comprises salvage Iecllte the eoonornll: I'eeslnlllly of s new manufacturing pian e me financial information for the brand new InIrIealment: I] r eclllte Mon-dereclahle Cs . Isl elthe end of $8 - . II Coalﬁ rI year.) Lleal'ul Ilte 188n- orlrlng Capltal — [at the end 151‘ the project Il‘lejr Loan F‘s-melts - ear I! 355!!! Intereelon Loan - er car 1011'. Loan Perlod 1mm 2 alt rate - per year 3011'. ITC - year I] so ITC - yeer1 MARE -= NFWA = -saum$230-(Pm.12%.5) = $2915 or NPWe : rs1unooszsn‘im.12%.xy newA = NFWE $29 15 = rs1uno¢$230=ii=m.12%.x1 see three 1 (PIA.12%.X) = four 47 through checth irre pastime table. it is mu "0 that ihe useiui lire wiII tie about 7 years. features] NPW lncre. ‘OTE:A.|'.'u.-1ll's are in thousand greenbacks alltlea as a speelarl 2w HADES Depreclatlon [with factors healer-e that the unsung cepllel la returned In your 2. e mmpnnf haa Income from other proleela and Ihla system Is aold at 2. 'llerest and prlnclpal repsymenla for the loan. [2 polnl| 50mm. 19184.108.40.206:- $402.50 new: First Coal-mm,“ + o a. M Cost Plum...“ + Salvage awhmmi new: -512.500+s2.51:o x iPiA.i.1oi + 515.0130 x ipiF.i.1ni First 0 E M PW S.V. PW Cost HALE lncrs. [FEELS] lncra. -S12.500 [PfA.i.10) - [PIF.i.10) - -512.500 4.192 5104800 01615 52.42250 -512.500 3.571 50.9275 0 107M $1511.00 20% s IRR< 25% lnterpolllte: ll - 1110‘: ' Hi = + — y ‘ ll: ' 111 r 20 + (0402,51xt25-202 _ (-1961 5.41325) 2°35 Therefore the Incremental [HR is 20.85% Which altemrative should be chosen? Why? [0.5 point + 1 point] $1381.50 .laﬂnn rate Ial MCRS rat] 7.1 You area $four.000 into an account paying an inﬂation-free eight% compounded yearly. Inflation is 5% all over each of the subsequent three years. a M! 515.501: a) The local township should still opt for model 2. as the incremental IRR: ,1 is better lharl MARE. which ability higher-can charge alternalive should still be chosen [2 l'+ f+i"‘f lIi‘llhat is the market interest rate?[1 point] = 0.08 +0.05 +0.08‘0.05 Calculate the alter-trait eaah II Ather‘l'u cash Flows l'rnrn aal Depreclab-le Cap-Ital: F = Ather‘l'u cash Flows l'rnrn aal Non—Depreelaole Capital: "1' The funding may still be undertaken. since the NPV is fantastic 0.134 mu) *three Or Dr 0.13 $four.000 X X ...., -. ...., ...... up...“ P... b} what's the account's price at the and of the 3 years?[1point] (1.1341313 (1.13113 $5,333.10 $5,771 .59 1 2 total 17500 17500 35000 4500 4500 9000 13000 13000 26000 8525 6975 1 5500 4475 6025 1 0500 550 288 838 3925 573? 0662 117'three 1721 2899 400 0 four hundred 3148 4016 7163 8525 6975 1 5500 11673 10991 22663 (2619) 9053 22590 11643 0.8696 0.7561 - 7373 17031 4954 (12127) 4954 CFA‘I' DC F C urn. DCF nuisaizaesr 10 eleven-9-10 | [20.0001 1.1mm menu | 20.000 9.053 0.8896 F373 | 1212? 0.110 0.?561 5.132 | (5.995) 3.500 2.546 | 3.000 I I 5?.EIIIL00 I 2.258 6.1 A current aeeet [defender] la hean evaluated tor potamhal replaeecnem. The latest "Met value ohhe defender la $123110. And Ila relnalnlnp manufacturan advantageous Ilfe la eelthnalad tube dyes-e. The salvage cost and malmenanoe coats for delender haa been llaled below. the brand new aaaele will coat sauna. which elao consist of a 2 - yr gnrenlzae oimainhenaneelyw1a 2}. The eallmated sewage value and upkeep coat llI 12 months three a yr 4 were proven In the following table. seventy one mmnwmmymmumxnmmgmmmammmrmmnmnuMuupun- dnllqumlI-Ilorpcnmmnlsl'imlmjrumtunnlmQMHWHIMMpIryummr ﬁlmlntmﬂﬂﬂ“ Immrnulﬁmmnmulmammmmwmmrmmmw year; I; mmlnnuuaum nmmmgm Intmlll inn-rm rm_| 2 pom-l 3 =¢1 a 21 1.12360 1.19"]? 125255 D'I Flllﬂﬂllmmﬂ'lllmm WNWWEMMHMMLHIM Flmwmwﬂllmﬂ HIrI:ImﬂuﬂﬂhﬂmlﬂmﬂﬂumﬂﬂlﬂmWHMRIIIIIIEIIIIIITWIIHI'IDI' MarlIIMARFl=t I-r-of-ol"! OR rzm' tmmdtplmni |= Dln'l ‘- DJIE ‘- 1mm 1-=.1¢.D6 rx 1m: raw F." 1:15 r=.ra manure”: humour-1 skill :Pﬁ.1ax11=[1._151~1= 11.51121 nan-amounts 1131195515 nan-ten IHJ'F.I§.§!L2l-= I1—u1aurq ems lFrFJanzpquH-H 11.1412 Mammal cum-14 11.715154 IFU'F.IE.§!LBP= [honour-a neat: IP1F.111!L:I. 543.2551”. 1555. a» same-«Fur. 155m ahMmE'lPtF. 11115.4: F'W = drnmm Sam-Inmate; + www.mvmmmwﬂaﬂ'mmm PW! I 47.93191 ew- PrPfHFIFINJ m: moon .mﬁzsmr. 155.1;1 $13.2ae1m.1m,2g + WIPE. 1mamma-IHF. lag-n Pn' mm: ~W2Hmu+ “anew-432] 1 “emanates-119061111593: PW= "tum: us 15!. 1551. CR “5.949.” 551.one hundred twenty five." 543,529.52 1:; nun. Imtmmummwtmm p-ollll H mm] res. “mummanmamm. d} mm mm til ninety five 5-18 1 IE 1‘ c 510 B4 “5382 It 9! - 1d 59? W1 I 86 ImunchHI-aylan e: When [Economic Lln‘al enould the will-ant aaeet be replaced? Why?“ polnu I polnl] As we've seen above. the marginal cost ofcwrent asaetla now not expanding. we use method 2 farenelyala. on the grounds that mlnlmum EUAC challengeris -= it should-turran EIMC of Defender. we will replace existing asset with the brand new one fumwaoefy. What are the expected current price for every option? [2 points] ElPW] = - Initlal Invesement + PW of Annual salary (PIA, 1536.6] EIPWJ = four hundred,000 + $503!!!! ' three.13“ = $90,360 ElPWZ}: - 35m «mm 1 23.7345 = $a hundred,052.05 (PM. 1595.6I = 33345 What alternatlye do you recommend and why? [1 polnts] Alternatlye 2 should still be chosen by the business beca use It has the biggest expected existing price for the 5 year! task ll according to mis. the different 2 choice should still he punched out in the resolution tree. 5.2 an organization is trying to do a alternative analysis an an: of Its diesel angina. The current market val no of th- nnginl i: sapno The 0 a. M EUAG Is given balm-v. Gnnsldlr simplest 0 a. II and capital reminiscence for your analysls. ‘I'hl HARR I: 15% and the unful I": loft [or III: main: is d "are. 3 4 = 2:3 (mew-54.. } CR ELIAS 1 1500 09.200 GR 08M EUAG Total EUAC 1 9.200 ' .I-‘OO 311,900 2 $4.921 53.500 55.421‘ .— 2302 - m c] wn-n should still the angina be mplaonﬂ'? Why? (1 point + 1 point] Yha engine should be replaced at 12 months .1. as it has the luwnstElM C. a: i am Inveslmntallemallm m belnzmnxldemd. m “an” hm been rash "am are aﬁumed m a; manna", there m s luluve sale; lanai! n Wmhlllllu an: annual ymnmx-wmlv, a] Alumni” mm investment mm.“ mm em a 1 mm mm mm; a pm A em a 1 mm magazine! a poor 0 count on the max a 15x m m Mm um wlll he 5 years a] Duwthe Dedxlm rm [Spainlsl alternative 1 seventy three eighty five,000 bl What he theatan value ofannlul mm lama. alternative? [2 palm Vlautmm!) ' mm «mm momma-um .u- mm: ssmnn 55m. amazon «2.1 r J1me: $forty one,900 What are the periodic price and the useful annual expense? [2 points] word: 5% ie nominal annual expense Nominal annual fee r=6% Jm=? 15:7 M=f2 what is the volume ol funds in the account on the conclusion of 6 years? [2 pt I: Fe no 010 rate Effective annual rate Number of compounded periods per year lm“ M r/M 0.50% (l + w” 7 1 g 1 +0.05)” 0.0617 6.17% 1.2 Jenna C. deposited $2000 into an account with 5% nominal annual ratcz'2 for 6 years. Determine the following: Effective rate F‘ = $2,000 in = o 0050 N = 72 A: whom)»: = $2,000 x = $2,000 1 : $2,864 1+0 005)“?2 1 ,4320 ll] eco-friendly County is planning to COnSlIUEI a bridge across the south branch of Carey Creek to tacilltate trafﬁc ﬂow via ClouserCanyon. at present there are two feasible plans for this construction. count on the minimum atlractlve return la 5%. answer questions in response to the lollowinu information. Desariptlon MachlneA desktop B l-‘Ir'st cost fifty nine.500000 810.500.000 Salvage value $0 $0 Annual OSxM charge 535.000 $25000 Llle Calculate the EUAC tor laptop A. [2 points] P I 9.500.000 S 5 _ Annual OSxM charge 1: 35.000 EUAC = CR + 0&M EUAC : PWP, f. N] - period/F, F, M + 06M I 9.500.000 ’ [NF.5%.20) 7 $ 7 ’ [NF.5%.20) + $ 35,000 15 9.500.000 " 0,0302 - $ - " 0 0302 + $ 35,000 EUAC= 5 7902900 Calculate the EUAC lor computing device B. [2 points] P 15 10,500,000 8 $ - Annual OSxM can charge 1: 25.000 EUAC = CR + 0&M EUAC = Pl‘A‘P, f. N) - SlA‘F, l, N)+ 0&M EUAC = 15 10,500,000 * Wessex.) - r» - * wrewza: + $25,000 EUA $ 10,500,000 " 0071 - $ - " 00210 + $25,000 EUAC: 5 770.500 Which machine may still he chose and why? [1 point +1 point] desktop B. as a result of ll has the decrease EUAC 2.1 superior Modular technology AMT plans to build up a plantto produce new proposed products. After an intensive analysis and device design, 2 plant designs have been proposed to the CEO of AMT. Answerlhe folluwing questions in line with the given statistics. Design El $425000 Annual earnings 5? 00 $ninety four 000 life 10 10 W a] Calculate 1l1e F'Illl' for hmh ofﬂie designs. [2 points] FW= AfPM, i, N] +F1'FIF, _. NJ -P WA: [ $15300 WA: ( $15300 PW = 921.200 315.000 X PEA. 12%.10 pl- 5100.000.0 X[ F'n'F. 1206.10 ]- 5350.000 $15,000 I X 5.05 + 5100,0000 I 0.322 - 5350.000 PWB= [ $94000 520.000 X PEA. 12%.10 Il- 5125.000.0 X[ F'n'F. 1206.10 1- 5425.000 PWE [ 594.000 - $20000 I X 5.05 + 512530000 X 0.322 - 5425.000 PWE 333,350 b Calculate the AW for bath of the designs. [2 poin‘ls] don't use PW] Aw: A +spw, f, w muse-1H] AWA= [ $?5.000 - $15000 + 3100.000 Xt AJ'F. 12%.10 ]-- $350.000 Kt AP. 12%. 10 I AWA= [ $?5.000 - $15000 + 8100.000 X 0.05? - $350.000 X 01?? AWA= $3.350 AWE: [ $94000 - $20,000 }+ $125,000 1': NF, 12%.10 ]-- $425000 X AP, 12%. 10 I AWE: [ $94000 - $20,000 + $a hundred twenty five,000 I 0.057 - $421000 X 0.1??0 AWE: $5,900 ...View Full doc